TSMC unveils its process technology roadmap through 2029, aiming to launch a new node yearly for client applications and every two years for AI and HPC
Still no High-NA on horizon. … TSMC revealed its general manufacturing technology roadmap through 2029 at its North American Technology Symposium 2026 on Wednesday.
TSMC plans to produce 3nm chips at its second plant in Kumamoto, Japan; sources say that is an upgrade from an original plan to produce 7nm chips by late 2027
Taiwan Semiconductor Manufacturing Co. plans to make advanced 3-nanometer chips in Japan, stepping up its semiconductor manufacturing roadmap …
Q&A with AMD CTO Mark Papermaster, who says AMD is the first customer for TSMC's 2nm process, on AMD's rise since he joined in 2011, AI in chip design, and more
Q&A with AMD CTO Mark Papermaster, who says AMD is the first customer for TSMC's 2nm process, on AMD's rise since he joined in 2011, AI in chip design, and more
The Future is Faster Than Anyone Expected — If you rewind the clock ten years, AMD 0.00%↑ was not the company it is today.
Microsoft unveils the Maia 200, its second-generation AI accelerator built on TSMC's 3nm process, deploying today in its Azure US Central data center region
The Maia 200 chip is starting to roll out to Microsoft's data centers today. … Microsoft is announcing a successor to its first in-house AI chip today, the Maia 200.
Microsoft unveils the Maia 200, its 2nd-generation AI accelerator built on TSMC's 3nm process, deploying today in its Azure US Central data center region
The Maia 200 chip is starting to roll out to Microsoft's data centers today. … Microsoft is announcing a successor to its first in-house AI chip today, the Maia 200.
Qualcomm unveils Snapdragon X2 Plus chips for PCs, available in 10-core and 6-core variants, manufactured on TSMC's N3P node using Qualcomm's Oryon architecture
AMD unveils Ryzen AI 400 Series chips for AI PCs, with up to 12 Zen 5 CPU cores and 16 RDNA 3.5 GPU cores, built with TSMC's N4X node, available in Q1 2026
Google unveils the $999+ Pixel 10 Pro and $1,199+ 10 Pro XL, with 6.3" and 6.8" OLED displays, Tensor G5 chips, and Zoned UFS storage, available from August 28
Starting with what's different at first glance. Morgan Truder / Shortlist : 5 things to know about the Google Pixel 10 — and what's on offer with the Fold Nirave Gondhia / Digital Trends : Google Pixe...
A roundup of the 2025 VLSI conference: using digital twins for design exploration, DRAM beyond 1x nm nodes, Intel's 18A process compared to TSMC, and more
Dylan Patel / SemiAnalysis : X: @semianalysis_ X: @semianalysis_ : Intel 18A Details & Cost Future of DRAM 4F2 vs 3D Backside Power Adoption (or Not) China's FlipFET Digital Twins from Atoms to Fabs ...