Sources: Samsung raised prices for advanced 4nm and 5nm chipmaking services by up to 15% for new orders in July, driven by AI demand and TSMC's tight capacity
Samsung Electronics (005930.KS) has raised prices for some advanced contract chipmaking services by up to 15% for new orders …
Sources: TSMC plans to hike advanced and mature node prices 5% to 10% in 2027, plus a 10% to 15% premium for advanced chip orders exceeding customers' forecasts
TAIPEI — TSMC is set to raise prices for both advanced and mature chip production services by up to 10% in 2027 to reflect rising costs …
A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to address this bottleneck in the US
A silicon wafer reflecting Subramanian Iyer, a specialist at the University of California, Los Angeles, in a technology called advanced chip packaging.
Sources: Samsung is seeing a rise in advanced chip production requests from BYD, Google, AMD, Tesla, and other companies as AI demand strains TSMC's capacity
TAIPEI/HONG KONG/SEOUL — BYD, Google, AMD, Tesla and others are looking increasingly to Samsung Electronics for contract chipmaking services …
Sources: Google recently placed an order with Intel to manufacture 3M+ TPUs in 2028; Nvidia is testing Intel's tech for a new processor and running 18A trials
TSMC's capacity struggles are turning into a boon for Intel. — As the Taiwanese chip making giant struggles to meet overwhelming demand …
TSMC CEO C.C. Wei says the company won't be able to fulfill the demand led by US customers even as more capacity comes online in the US over the next few years
Taiwan Semiconductor Manufacturing Co.'s global chip supply will fall short of AI-fueled demand for years to come …
TSMC says it will hold off on using ASML's most advanced high-NA EUV machines, costing upwards of €350M apiece, for chip production through 2029 to save money
TSMC CEO C.C. Wei says TSMC checked with customers about AI demand and was reassured that it was still strong amid the Iran war, as it raises revenue forecasts
Taiwan company expects revenue to grow by more than 30% and doesn't see material disruptions to supply chain
TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reserved most of TSMC's CoWoS capacity
An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.
TSMC's N3 logic wafer capacity has become one of the AI industry's biggest constraints, which could push customers to explore greater foundry diversification
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner — Ivan Chiam, Myron Xie, Ray Wang, and 3 others