TSMC says it will hold off on using ASML's most advanced high-NA EUV machines, costing upwards of €350M apiece, for chip production through 2029 to save money
TSMC CEO C.C. Wei says TSMC checked with customers about AI demand and was reassured that it was still strong amid the Iran war, as it raises revenue forecasts
Taiwan company expects revenue to grow by more than 30% and doesn't see material disruptions to supply chain
TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reserved most of TSMC's CoWoS capacity
An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.
TSMC's N3 logic wafer capacity has become one of the AI industry's biggest constraints, which could push customers to explore greater foundry diversification
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner — Ivan Chiam, Myron Xie, Ray Wang, and 3 others
TSMC's N3 logic wafer capacity has become one of the AI industry's biggest constraints, which could push customers to explore greater foundry diversification
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner — Ivan Chiam, Myron Xie, Ray Wang, and 3 others
Sources: Nvidia has reallocated manufacturing capacity at TSMC away from making H200 chips, intended for the Chinese market, to its next-gen Vera Rubin products
Sources: TSMC urges clients to apply for N2 production allocation as far out as Q2 2027, with large capacity allotments nearly sold out for the next two years
Sources: TSMC urges clients to apply for N2 production allocation as far out as Q2 2027, with large capacity allotments nearly sold out for the next two years
[Exclusive] Clients are being asked to finalize their requirements into mid 2027, with larger customers already booking capacity over the next two to three years.
Cisco unveils its Silicon One G300 switch chip, made using TSMC's 3nm tech, to take on Broadcom and Nvidia in AI infrastructure, set to go on sale in H2 2026
Cisco unveils its Silicon One G300 switch chip, made using TSMC's 3nm tech, to take on Broadcom and Nvidia in AI infrastructure, set to go on sale in H2 2026
Cisco Systems (CSCO.O) on Tuesday launched a new chip and router designed to speed information through massive data centers that will compete …