Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users
Sources: Google is in talks with Samsung to manufacture a memory input-output die for Icefish, its 10th-generation TPU, and TSMC will make the computing engine
Sources: Google is in talks with Samsung to manufacture a memory input-output die for Icefish, its 10th-generation TPU, and TSMC will make the computing engine
Google is considering giving Samsung Electronics a crucial role in making a component of one of its most advanced future AI chips …
MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth
TAIPEI — MediaTek says it has started working with Intel for advanced chip packaging in addition to its existing relationship with TSMC …
Sony and TSMC announce a joint venture to build next-gen robot and car image sensors, as Sony moves from in-house manufacturing to a more asset-light approach
A deep dive into how ASML became a chokepoint for making cutting-edge chips by betting on EUV, closely collaborating with TSMC and the US government, and more
By betting on extreme ultraviolet lithography long before it worked, ASML became the chokepoint for cutting-edge chips.
TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun
Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.
A deep dive into co-packaged optics, long promised to transform data center connectivity, covering benefits, challenges, architecture, key companies, and more
SemiAnalysis : LinkedIn: Igor Elkanovich LinkedIn: Igor Elkanovich : See below an excellent paper on Co-Packaged Optics (CPO). A conclusion is that Scale Up network is a killer application and TSMC'...
A deep dive into co-packaged optics, long promised to transform data center connectivity, covering benefits, challenges, architecture, key companies, and more
Scale-out and Scale-up CPO, CPO TCO and Power Budgets, DSP Transceivers vs LPO vs NPO vs CPO, TSMC COUPE, MZM vs MRM vs EAM Modulator Deep Dive … LinkedIn: Igor Elkanovich LinkedIn: Igor Elkanovich : ...
Elon Musk says Tesla's AI5 chip will be made by Samsung in Texas and TSMC in Arizona, with the “oversupply” of chips not used by Tesla going to his data centers
Elon Musk, on the AI5 chip, which is 40x better than the AI4 chip [image] Ed Ludlow / @edludlow : Musk's clarification on Samsung seems important. He's saying Samsung is involved in the AI5 process. P...