Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks
ASML Holding NV has won commitments from top chipmakers to use its latest semiconductor production gear, while embarking …
Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks
ASML Holding NV has won commitments from top chipmakers to use its latest semiconductor production gear, while embarking …
Arm debuts Neoverse CSS N4, its next-gen semi-custom chip design platform built on TSMC's N3P node, with support for 8 to 128 Neoverse N4 cores at up to 3.8 GHz
Putting a little pep in Neoverse N-series' step. … Arm is bringing its next-gen Neoverse CSS N4 platforms to the cloud …
Sources: Samsung raised prices for advanced 4nm and 5nm chipmaking services by up to 15% for new orders in July, driven by AI demand and TSMC's tight capacity
Samsung Electronics (005930.KS) has raised prices for some advanced contract chipmaking services by up to 15% for new orders …
TSMC and Sony plan to form Advanced Vision Semiconductor Manufacturing Corp, a $4.69B joint venture in Japan to make next-gen smartphone image sensors from 2029
TSMC and Sony plan to form Advanced Vision Semiconductor Manufacturing Corp, a $4.69B joint venture in Japan to make next-gen smartphone image sensors from 2029
Taiwanese chipmaker TSMC (2330.TW) and Sony Group (6758.T) said on Tuesday they will form a $4.69 billion joint venture to develop …
Sources: Microsoft plans to unveil its next-gen AI chip, the Maia 300, potentially as soon as September, and is in talks with TSMC to make 300K+ chips for 2027
Sources: Microsoft plans to unveil its next-gen AI chip, the Maia 300, potentially as soon as September, and is in talks with TSMC to make 300K+ chips for 2027
Microsoft is planning to significantly increase production of its internally designed next-generation AI chips next year in hopes …
Sources: Sony and TSMC plan a ~$6.3B JV, owned ~60% by Sony and ~40% by TSMC, to mass produce next-gen image sensor chips in Kumamoto, Japan, as early as 2029
TOKYO/KUMAMOTO, Japan/TAIPEI — Sony Group and Taiwan Semiconductor Manufacturing Co. (TSMC) plan to begin mass production …
Sources: TSMC is developing advanced AI chip packaging tech, internally called “EMIB-like”, similar to Intel's Embedded Multi-die Interconnect Bridge technique
Taiwan Semiconductor Manufacturing Co. is developing an advanced chip-packaging technology similar to what Intel already offers …