TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun
Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.
TSMC says it will hold off on using ASML's most advanced high-NA EUV machines, costing upwards of €350M apiece, for chip production through 2029 to save money
TSMC unveils its process technology roadmap through 2029, aiming to launch a new node yearly for client applications and every two years for AI and HPC
Still no High-NA on horizon. … TSMC revealed its general manufacturing technology roadmap through 2029 at its North American Technology Symposium 2026 on Wednesday.
TSMC CEO C.C. Wei says TSMC checked with customers about AI demand and was reassured that it was still strong amid the Iran war, as it raises revenue forecasts
Taiwan company expects revenue to grow by more than 30% and doesn't see material disruptions to supply chain
TSMC reports Q1 revenue up 35.1% YoY to ~$35B, net income up 58.3% YoY to ~$18B, both above est., and says 7nm or smaller chips were ~74% of its wafer revenue
Taiwan Semiconductor Manufacturing Company on Thursday reported a 58% increase in first-quarter profit, beating estimates and hitting …
TSMC reports Q1 revenue up 35% YoY to ~$35.6B, vs. ~$35.2B est., signaling global chip demand stayed intact during the first weeks of the war in the Middle East
Taiwan Semiconductor Manufacturing Co. reported a 35% increase in quarterly revenue, suggesting global AI chip demand remained intact during …
TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reserved most of TSMC's CoWoS capacity
An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.
Q&A with Arm CEO Rene Haas on changing Arm's culture, working with Arm owner SoftBank, developing Arm's AGI CPU data center chip fabricated by TSMC, and more
Lauren Goode /Wired:
TSMC's N3 logic wafer capacity has become one of the AI industry's biggest constraints, which could push customers to explore greater foundry diversification
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner — Ivan Chiam, Myron Xie, Ray Wang, and 3 others
TSMC's N3 logic wafer capacity has become one of the AI industry's biggest constraints, which could push customers to explore greater foundry diversification
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner — Ivan Chiam, Myron Xie, Ray Wang, and 3 others