2024-12-19
Bloomberg
2 related
The US finalizes a $458M grant for SK Hynix under the CHIPS Act and $500M in loans to build a $3.87B chip packaging facility in Indiana
Mackenzie Hawkins / Bloomberg :
2024-08-06
Bloomberg
11 related
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act
- Firm to get $450 million Chips Act grant, $500 million loan — Indiana facility focused on advanced packaging, research
2024-04-04
Reuters
13 related
SK Hynix plans to invest ~$3.87B in an advanced packaging plant and R&D facility in West Lafayette, Indiana, to produce high bandwidth memory chips from H2 2028
Joyce Lee / Reuters :
2024-03-26
Wall Street Journal
3 related
Sources: SK Hynix plans to spend ~$4B to build an advanced chip packaging facility in West Lafayette, Indiana; a source says operations could begin in 2028
The South Korean memory chip maker is expected to build an advanced-packaging facility in West Lafayette, creating up to 1,000 jobs.
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