Applied Materials partners with Micron and SK Hynix to develop next-gen memory chips for AI and HPC at its new EPIC center, part of a planned $5B R&D investment
Applied Materials (AMAT.O) said on Tuesday it has partnered with memory chip companies Micron Technology (MU.O) and SK Hynix …
Nvidia announces it has acquired SchedMD, the developer of Slurm, an open-source workload management system for HPC and AI
Nvidia (NVDA.O) said on Monday it acquired AI software firm SchedMD, as the chip designer doubles down on open-source technology and steps up investments …
AWS announces a commitment to invest up to $50B to build AI and HPC infrastructure for the US government, starting in 2026 and adding nearly 1.3 GW of capacity
Eric Revell / Fox Business :
AWS announces a commitment to invest up to $50B to build AI and HPC infrastructure for the US government, starting in 2026 and adding nearly 1.3 GW of capacity
AWS CEO says investment will remove technology barriers holding back federal agencies — EXCLUSIVE: Amazon Web Services (AWS) …
The Ultra Ethernet Consortium, whose members include AMD, Cisco, HPE, and Intel, publishes its 1.0 specification for enhancing Ethernet standards for AI and HPC
Pensando Pollara provides up to 400 Gbps performance Tanj Bennett / SemiAnalysis : The New AI Networks | Ultra Ethernet UEC | UALink vs Broadcom Scale Up Ethernet SUE Ultra Ethernet Consortium : Ultra...
The Ultra Ethernet Consortium, whose members include AMD, Cisco, HPE, and Intel, publishes its 1.0 specification for enhancing Ethernet standards for AI and HPC
The UEC 1.0 specification includes a modern RDMA approach, new transport protocols, and congestion control mechanisms designed for AI and HPC requirements.
Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned $1.6B facility in Peoria, Arizona
Anton Shilov / Tom's Hardware :
Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned ~$2B facility in Peoria, Arizona
Apple and Nvidia rejoice. — When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria …
Q&A with AMD CEO Lisa Su on competing with Nvidia's H100, PyTorch, AI regulation, the US CHIPS Act, diversifying from TSMC, the global supply chain, and more
AI is just another HPC app. Broadly speaking: same math, same skillset, same infrastructure. And even more so in the future. — https://www.theverge.com/... Forums: r/hardware : AMD CEO Lisa Su on ...
The Linux Foundation forms the Ultra Ethernet Consortium with AMD, Cisco, HPE, Intel, Meta, Microsoft, and others to optimize Ethernet standards for AI and HPC
UEC to deliver on Ethernet-based open, interoperable, high-performance full-communications stack architecture to meet the growing network demands of AI & HPC at scale. Rakesh Chopra : AI/ML will influ...