An in-depth look at a recent research paper that offered a roadmap to the viability of 3D HBM-on-GPU integration for improved AI performance and utilization
Five Things You Should Know Before Reading: — “3D HBM” Now Feasible: Offers improved AI performance and utilization.
Huawei unveils the Atlas 950 SuperPoD with 8,192 Ascend NPUs and the Atlas 960 SuperPoD with 15,488 Ascend NPUs, both with Huawei's new HBM, to challenge Nvidia
Huawei Technologies Co. unveiled new technology from memory chips to AI accelerators Thursday, outlining publicly …
Samsung launches 36GB 12H HBM3E DRAM for AI, slated for mass production in H1 2024, with 50%+ more peak bandwidth and capacity compared to its previous HBM gen
Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks …
Meta outlines its RSC supercomputer and its work on two chips: MTIA for accelerating AI training, set for release in 2025, and MSVP, for video processing needs
#riscv Mikael Strandlund : Meta's Engineering and Infrastructure teams are excited to host AI Infra @Scale, a one-day virtual event featuring a range of speakers from Meta … Roman Levenstein : I'm thr...
AMD focuses on performance with x86 Zen CPU architecture and High Bandwidth Memory GPUs, says it can't just be “the cheaper solution”
AMD admits it can't be “the cheaper solution,” will refocus on performance — AMD bets on Zen CPU architecture and HBM-equipped GPUs to see it through.