Sources: Nvidia is considering lower-memory versions of its Rubin Ultra GPU due to potential issues securing enough HBM, and has tested at least three versions
Nvidia is weighing a radical step to deal with a shortage of advanced high-bandwidth memory chips: using less of it than planned …
Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture
Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency …
Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture
Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency …
Academic papers and conference materials offer a deep dive into China's all-CPU LineShine, which pairs custom 304-core Arm CPUs with HBM to top the Top500
CO-EDITOR, CO-FOUNDER, THE NEXT PLATFORM — It has been nine years since a Chinese HPC supercomputer was at the top …
Intel details its Crescent Island data center GPUs, built on its Xe3P architecture and using LPDDR5X memory instead of HBM, calling them “built for agentic AI”
Unusual memory choice brings lots of AI data closer to the chip for efficiency — At Computex 2026 …
A look at DeepSeek's model optimization to reduce HBM use, potentially enabling domestic memory, ASIC, and CPU makers to create a Chinese AI hardware ecosystem
Have you ever wondered, how DeepSeek may make money, and lot of it? They didn't come up with competitive coding plans like GLM, MoonShot and MiniMax.
An in-depth look at a recent research paper that offered a roadmap to the viability of 3D HBM-on-GPU integration for improved AI performance and utilization
Five Things You Should Know Before Reading: — “3D HBM” Now Feasible: Offers improved AI performance and utilization.
Huawei unveils the Atlas 950 SuperPoD with 8,192 Ascend NPUs and the Atlas 960 SuperPoD with 15,488 Ascend NPUs, both with Huawei's new HBM, to challenge Nvidia
Huawei Technologies Co. unveiled new technology from memory chips to AI accelerators Thursday, outlining publicly …
Samsung launches 36GB 12H HBM3E DRAM for AI, slated for mass production in H1 2024, with 50%+ more peak bandwidth and capacity compared to its previous HBM gen
Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks …
Meta outlines its RSC supercomputer and its work on two chips: MTIA for accelerating AI training, set for release in 2025, and MSVP, for video processing needs
#riscv Mikael Strandlund : Meta's Engineering and Infrastructure teams are excited to host AI Infra @Scale, a one-day virtual event featuring a range of speakers from Meta … Roman Levenstein : I'm thr...