Center for Technology & Statecraft: Chinese fabs had acquired ~343 DUVi tools by early 2026, with ~270 from ASML; DUVi can be adapted to make 7nm chips and HBM
DUV tools, though not as advanced as EUV, can be adapted to manufacture 7-nm logic chips and advanced memory for AI processors, report says.
Center for Technology & Statecraft: Chinese fabs had acquired ~343 DUVi tools by early 2026, with ~270 from ASML; DUVi can be adapted to make 7nm chips and HBM
DUV tools, though not as advanced as EUV, can be adapted to manufacture 7-nm logic chips and advanced memory for AI processors, report says.
Sources: Chinese AI chipmakers Huawei, Cambricon, MetaX, and Iluvatar CoreX have raised prices for current and next-gen chips by 20%-50% due to rising HBM costs
Chinese AI chipmakers including Huawei Technologies [RIC:RIC:HWT.UL] and Cambricon (688256.SS) have sharply raised prices …
Kepler Computing, which claims its 3D stacking and new material can increase HBM and SRAM density without relying on EUV, emerges from stealth with $468M
Kepler Computing claims a new approach to chip design—and a proprietary material—can help end the supply bottlenecks that have sent memory prices surging.
SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029
SK Hynix Inc. held a groundbreaking ceremony Thursday for its advanced memory packaging facility in Indiana …
SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029
SK Hynix Inc. held a groundbreaking ceremony Thursday for its advanced memory packaging facility in Indiana …
Sources: Nvidia is considering lower-memory versions of its Rubin Ultra GPU due to potential issues securing enough HBM, and has tested at least three versions
Nvidia is weighing a radical step to deal with a shortage of advanced high-bandwidth memory chips: using less of it than planned …
Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture
Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency …
Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture
Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency …