Intel says it will spend $7B to expand its chip packaging facilities in Penang, Malaysia
- CEO is in Asia this week for talks with TSMC, partners — The investment marks a major outlay for the American firm — Intel Corp. is spending $7 billion to build a new chip packaging facility …
If its part of IFS, then either $7B is only what Intel is putting in and there is a big sum from govt also together making an advance node possible... OR IFS is being planned for mature nodes also. Lets wait for wednesday. https://www.reuters.com/...