Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks
ASML Holding NV has won commitments from top chipmakers to use its latest semiconductor production gear, while embarking …
The new commitments turn that earlier access into a dated production roadmap for Samsung and TSMC, alongside Intel’s adoption. The joint move to 12-inch photomasks also addresses the mask-format constraint associated with deploying high-NA EUV at scale.
First-order effects
ASML gains production-adoption commitments from Samsung by 2028 and TSMC by 2030, while Intel remains an early committed user of its high-NA EUV platform.
Samsung, TSMC, Intel and ASML align on a 12-inch photomask transition, requiring their high-NA EUV process plans to accommodate the larger format.
Second-order effects
Photomask suppliers and the equipment vendors serving them face a defined demand signal to support 12-inch masks, rather than maintaining the 6-inch format as the sole production standard.
TSMC’s 2030 timetable preserves its cost-conscious sequencing from its earlier decision to delay high-NA production use, while Samsung’s 2028 target creates a nearer production milestone for ASML’s customer base.
Third-order effects
A shared large-mask format can reduce fragmentation in high-NA EUV manufacturing and make ASML’s platform more central to leading-edge logic and memory process roadmaps.
If the three chipmakers execute on their commitments, advanced-fab capital spending becomes more tightly coupled to a small set of lithography and mask-format choices set years ahead.
The trend: AI-driven demand for advanced logic and memory is pushing chipmakers from evaluating high-NA EUV tools toward coordinated, long-horizon production standards.
This is big. $INTC & $TSM moving to 6x12" masks. Will mean High-NA EUV can do the same reticle size as Low NA EUV by doubling the mask size. $INTC is ahead, working w. IMS Nano & ASML + lots of interest from large reticle-size GPU designers. The added weight of $TSM helps
📢High NA EUV is being adopted for production of leading-edge chips in both logic and memory. Now it's time to look to the future: With TSMC, we're rallying the chip industry around larger masks to give High NA EUV a productivity boost. Learn more 👇 https://www.asml.com/...
Today ASML and Intel not only did announce that one million High-NA EUV wafers were processed, but also they are making the transition to 6x12-inch masks. This will help to overcome one of the current limitations.
The growing need for High NA EUV to produce advanced logic and memory chips has given momentum to a new industry initiative to develop larger photomasks. …
Samsung Electronics and TSMC plan to begin adopting ASML's High NA EUV lithography equipment for high volume manufacturing by 2028 and from 2030 respectively …