Details emerge on Intel's Indian website about its first “Intel with Radeon RX Vega Graphics” processor: Core i7-8809G with 3.1 GHz Base, 100W target TDP
Ian Cutress / AnandTech :
Context & Ripple Effects
Days before Intel's official launch of 8th Gen Core with Radeon RX Vega M Graphics, the spec sheet for the flagship part — the Core i7-8809G at 3.1 GHz base and a 100W target TDP — has surfaced on Intel's own Indian site. The listing confirms the unusual shape of the deal: an Intel x86 die and an AMD Radeon Vega GPU delivered as one package.
That makes this the first time Intel has shipped AMD graphics inside its own silicon, a partnership neither company had previously put into volume products.
First-order effects
- Small-form-factor system builders get a soldered CPU-plus-discrete-class-GPU package that needs no graphics card slot, with the 100W envelope defining the cooling budget for the resulting mini-PC designs.
- AMD gains a revenue stream from licensing Radeon Vega IP into Intel's channel — monetizing its graphics architecture without waiting on its own OEM wins.
Second-order effects
- NVIDIA's default position in compact systems is challenged wherever a single-package Intel+Vega part can replace a CPU plus a discrete GeForce board, pressuring entry-level discrete GPU attach rates.
- Notebook and mini-PC OEMs choosing between this package and traditional CPU+dGPU builds now weigh Intel's platform integration against NVIDIA's graphics performance per watt.
Third-order effects
- Two rivals sharing one package normalizes heterogeneous integration across corporate boundaries — the same packaging-first logic AMD later pushed with 3D V-cache stacked mobile CPUs.
- The 100W target for a mobile-class hybrid part marks an early point on the power-envelope climb that leads to flagship desktop chips like the Core i9-13900KS at 150W, forcing cooling and platform design to absorb ever-larger thermal budgets.
The trend: Processor vendors are shifting from single-die CPUs toward multi-silicon packages that combine CPU and GPU from different suppliers, trading board-level flexibility for integrated performance.