SK Hynix starts mass producing its new 12-layer HBM3E chips with 36GB per chip capacity, up 50% from its previous gen, slated for delivery by the end of 2024 Anniek Bao / CNBC : CNBC 2024-09-26 Anniek Bao Anniek Bao, SK Hynix Related Coverage View article SK hynix Newsroom SK hynix begins mass production of 36 GB 12-layer HBM3E The Register SK Hynix Is Mass Producing 12-Layer 36GB HBM3E For Memory Hungry AI Workloads HotHardware SK hynix preps for Nvidia Blackwell Ultra and AMD Instinct MI325X with 12-Hi HBM3E Tom's Hardware SK hynix outpaces Samsung, Micron with more powerful AI chips The Korea Herald SK hynix starts mass production of 12-layer HBM3E memory: 36GB capacity per module @ 9.6Gbps TweakTown SK hynix Initiates Mass Production of Advanced 12-Layer HBM3E Memory Modules Guru3D SK Hynix mass-produces 12-layer HBM3E for Q4 shipment KED Global SK Hynix Begins Mass-production of 12-layer HBM3E Memory TechPowerUp Nvidia Supplier SK Hynix Soars 9% As Mass Production Of Advanced HBM3E Chips Begins Amid Burgeoning AI Demand Benzinga Analysis Nvidia’s 70% HBM4 Allocation to SK Hynix Discussion SK hynix Newsroom SK hynix Newsroom on x SK hynix Begins Volume Production of the World's First 12-Layer HBM3E