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MediaTek announces its Dimensity 9300 chip, using TSMC's 4nm process, arriving in high-end Android smartphones and tablets before the end of 2023

MediaTek claims its new flagship mobile processor, the Dimensity 9300, will provide the performance, AI power, and multimedia capabilities needed …

PCMag Eric Zeman

Context & Ripple Effects

The Dimensity 9300 extends MediaTek’s flagship push after the earlier Dimensity 9000 generation on TSMC 4nm, moving the company’s top-tier mobile platform into late-2023 Android phones and tablets.

Later Dimensity releases shifted to 3nm and put increasingly explicit emphasis on on-device AI, including the Dimensity 9400’s upgraded NPU and LLM-performance claims. That makes the 9300 an early step in a continuing premium-platform cadence rather than a one-off launch.

First-order effects

  • Android device makers gain a new TSMC-built 4nm flagship option for products planned before year-end, while MediaTek can compete for higher-end phone and tablet design wins.
  • TSMC receives another flagship mobile-chip customer program on its 4nm process, tying MediaTek’s premium-device rollout to the foundry’s advanced-node supply.

Second-order effects

  • Rival Android silicon suppliers face pressure to match MediaTek’s performance, AI and multimedia positioning in their own flagship platforms, while OEMs have more leverage in selecting a premium chipset supplier.
  • The launch reinforces the commercial value of advanced-node capacity for mobile silicon: handset launches and chip availability become more closely coupled to TSMC’s production execution.

Third-order effects

  • If successive Dimensity generations continue to advance CPU, graphics and AI capabilities together—as the later Dimensity 9500 platform suggests—premium mobile chips will increasingly be judged as heterogeneous AI systems rather than primarily as CPU upgrades.
  • MediaTek’s recurring flagship cadence could modestly broaden high-end Android chip competition, although sustained gains depend on device-maker adoption and competitive product execution.

The trend: Flagship Android silicon is evolving toward tightly integrated CPU, graphics, multimedia and on-device AI platforms built on leading foundry nodes.

Discussion

  • @t3mporarybl1p @t3mporarybl1p on x
    So the MediaTek Dimensity 9300 is official - what a beast! Like the SD8G3, on-device generative AI support is a central feature. First smartphone, yet to be revealed, will ship with the chip before the end of the year: [image]
  • @geeky_vaidy @geeky_vaidy on x
    No efficiency cores on the Dimensity 9300 [image]
  • @sondesix Alvin on x
    MediaTek officially announces the new Dimensity 9300 SoC, a processor for 2024 high-end phones! ✅️ The first “all-large-core CPU cores” in a smartphone SoC. ✅️ CPU core configuration: 1x3.25 GHz Cortex-X4 + 3x2.85 GHz Cortex-X4 + 4x2.0 GHz Cortex-A720. ✅️ 40% improved... [image]
  • @faridofanani96 @faridofanani96 on x
    The 60fps ray-tracing version of “Dark Zone Breakout” is the first to be adapted to the Dimensity 9300 platform “World of Sword and Fairy” ray-tracing version launched on MediaTek Dimensity 9300 platform. [image]
  • @faridofanani96 @faridofanani96 on x
    Dimensity 9300 vs Dimensity 9200 [image]