TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reserved most of TSMC's CoWoS capacity
An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.
Advanced packaging - it's a last step in making chips - and the next AI bottleneck. #Nvidia has reserved most of it and 100% of TSMC chips have to be sent to Taiwan for it. Now TSMC is building its first U.S. packaging plants as @elonmusk taps Intel for it https://www.youtube.com…