Intel will bring “chiplet” packaging to its Meteor Lake chips in 2023 and Arrow Lake and Lunar Lake chips slated for 2024, to better compete with Apple silicon
This is how AMD builds its top-end PC processor, the Ryzen 7 5800X3D, and how Apple glues two M1 Max chips into the M1 Ultra. Intel's Meteor Lake is meant to bring that sort of packaging to mainstream PCs w/o an eye-popping price tag. https://www.cnet.com/... via @stshank @CNET
Good piece on chip packaging technology by @stshank that rightly points out how it's going to be essential to future semiconductor industry trends and the opportunity it gives @intel: Why Stacking Chips Like Pancakes Could Mean a Huge Leap for Laptops https://www.cnet.com/...