SK Hynix will invest ~$12.9B to build an advanced chip packaging plant in South Korea to meet rising memory chip demand, targeting completion by the end of 2027
South Korea's SK Hynix (000660.KS) said on Tuesday it has decided to invest 19 trillion won ($12.90 billion) …
Amkor breaks ground on advanced chip packaging campus in Arizona, with production expected by early 2028; state officials say Amkor's investment could reach $7B
Amkor moves in next door to TSMC as CHIPS Act funding continues to turn the Phoenix metro area into a chips hub.
Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned $1.6B facility in Peoria, Arizona
Anton Shilov / Tom's Hardware :
Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned ~$2B facility in Peoria, Arizona
Apple and Nvidia rejoice. — When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria …
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act
- Firm to get $450 million Chips Act grant, $500 million loan — Indiana facility focused on advanced packaging, research
The US Commerce Department says it signed a nonbinding preliminary agreement with Amkor for a CHIPS Act award consisting of $400M in grants and $200M in loans
Amkor to receive $600 million for advanced chip packaging facility Mackenzie Hawkins / Bloomberg : Amkor Wins $600 Million in US Grants, Loans for Chip Packaging Nick Flaherty / eeNews Europe : Amkor ...
The Biden administration plans to direct up to $1.6B in CHIPS Act funding towards R&D to accelerate domestic capacity for advanced chip packaging
Don Clark / New York Times :
SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech
Nikkei Asia :
SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech
Nikkei Asia :
Sources: SK Hynix plans to spend ~$4B to build an advanced chip packaging facility in West Lafayette, Indiana; a source says operations could begin in 2028
The South Korean memory chip maker is expected to build an advanced-packaging facility in West Lafayette, creating up to 1,000 jobs.