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TEXXR

Chronicles

The story behind the story

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How the US is trying to transform the world's chip supply chain, including getting more countries to set up factories to do final chip assembly and packaging

New York Times :

New York Times

Context & Ripple Effects

This broadens a U.S. semiconductor-resilience campaign that previously centered on attracting wafer fabs, including early talks with Intel and TSMC about U.S. facilities and later projections of higher domestic manufacturing capacity. The new emphasis recognizes that fabrication alone does not complete a chip supply chain.

It also arrives amid competing national supply-chain strategies: China was pursuing a less U.S.-dependent domestic chip industry, while more than 35 companies had already pledged chip-manufacturing projects across U.S. states in the earlier buildout.

First-order effects

  • U.S. supply-chain policy extends downstream from chip fabrication to final assembly and packaging, making those stages a direct focus for prospective partner countries and manufacturers.
  • Countries that participate can become part of a more geographically distributed route from finished wafers to usable chips, rather than being considered only as end markets or fabrication hosts.

Second-order effects

  • Chipmakers and packaging providers face a stronger incentive to evaluate multi-country production footprints, because the resilience value of a new fab depends on access to downstream finishing capacity.
  • The effort complements the projected expansion of U.S. chip manufacturing capacity: added wafer output will have greater strategic value if assembly and packaging bottlenecks are also diversified.

Third-order effects

  • If sustained, the policy points toward semiconductor supply chains organized around politically aligned, multi-country production networks rather than a single concentrated manufacturing geography.
  • That diversification will not eliminate dependence by itself: packaging capacity, manufacturing know-how, and cross-border coordination can become the next constraints even as new fabs are built.

The trend: Semiconductor industrial policy is shifting from subsidizing individual fabs to coordinating end-to-end, geographically diversified supply chains.

Discussion

  • @ali_wyne Ali Wyne on x
    .@ewong and @AnaSwanson discuss the efforts of past and present officials in the Biden administration (such as @RaminToloui, who until recently served as assistant secretary of @EconAtState) to stand up U.S. “chip diplomacy.” https://www.nytimes.com/...
  • @ewong Edward Wong on x
    NEW: To hedge against risks tied to China and boost US manufacturing, the Biden administration is trying to change the world's supply chains of semiconductors and green tech. Biden mentioned this in his @ABC interview. We have details. w/ @AnaSwanson. https://www.nytimes.com/...
  • r/politics r on reddit
    U.S. Creates High-Tech Global Supply Chains to Blunt Risks Tied to China |  The Biden administration is trying to get foreign companies to invest …