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Chronicles

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Ayar Labs, which is developing a way to link AI chips directly with optical connections, raised a $150M extension to its $500M Series E announced in March 2026

Reuters Stephen Nellis

Context & Ripple Effects

Ayar Labs has pursued optical interconnects for high-performance computing since its $35M Series B in 2020, then added a $130M Series C in 2022 backed by Nvidia, Intel and others. Its March 2026 Series E, led by Neuberger Berman at a $3.8B valuation, marked a much larger financing phase aimed at replacing chip-level copper wiring with optical links.

The added $150M brings Ayar's 2026 financing to $650M, giving its optical-link approach a deeper capital base as AI systems require connections among more chips.

First-order effects

  • Ayar Labs gains an additional $150M to advance and scale optical connections that directly link AI chips, on top of the $500M raised in March.
  • The extension reinforces Ayar's position with a $650M 2026 funding pool for an interconnect technology that targets the links between AI chips.

Second-order effects

  • Celestial AI, which raised a $175M Series C in 2024 for optical links between processors and memory, faces a better-funded rival in the race to supply optical connectivity for high-performance systems.
  • AI-chip and system builders evaluating optical interconnects gain a more heavily financed prospective supplier, increasing competitive pressure around the transition away from copper links.

Third-order effects

  • If late-stage funding continues to concentrate around optical interconnect suppliers, AI infrastructure spending will extend beyond processors and memory into the connections that bind chip clusters together.
  • The financing points to AI infrastructure becoming a broader component-stack market, where interconnect vendors need capital not only for chip development but also for deployment at system scale.

The trend: AI infrastructure investment is broadening from compute chips toward the optical interconnects needed to link larger AI systems.