Broadcom squeezes 11n, Bluetooth, FM into new, cheap chip
Broadcom has released the latest of its so-called combo wireless chips, this time putting single-stream 802.11n, Bluetooth 2.1+EDR, and FM radio reception and short-range transmission into its BCM4329.
Context & Ripple Effects
In late 2008, Broadcom's combo-chip strategy was about collapsing multiple radios onto one die to cut cost and board space in handsets. The BCM4329's blend of single-stream 802.11n, Bluetooth 2.1+EDR, and FM is an early step in a line that ran through Broadcom's first 802.11ac Wi-Fi chip for smartphones in 2012 and its Wi-Fi 6E chip promising 2 Gbps+ with better battery life in 2020. That integration playbook also underpinned the wireless-chip franchise behind Broadcom's later multi-year Apple supply agreements worth an expected $15B.
First-order effects
- Handset makers gain a single low-cost part replacing separate Wi-Fi, Bluetooth, and FM components, shrinking the bill of materials and freeing board space in mid-range phones.
- Broadcom strengthens its position as a one-stop connectivity supplier just as 802.11n begins migrating from laptops into mobile devices.
Second-order effects
- Rival wireless chipset vendors are pushed into their own integration races, accelerating the shift from discrete radios to combo parts across the industry.
- Features like FM reception and Bluetooth EDR become effectively free add-ons at the silicon level, raising the baseline spec buyers expect even in cheap handsets.
Third-order effects
- If the pattern holds, connectivity becomes a consolidated-silicon business where scale and integration wins, concentrating wireless chip supply among a few vendors — a structure visible in Broadcom's later multi-billion-dollar OEM relationships.
- Single-die radio integration sets the template for every subsequent Wi-Fi generation landing first in smartphones, making the handset the lead platform for wireless standards rather than the PC.
The trend: The steady consolidation of multiple wireless radios into single low-cost combo chips, which turned integrated connectivity silicon into a scale-driven business dominated by a handful of suppliers.