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Australia-based Syenta, which aims to use electrochemical “stamping” to speed up chip manufacturing, raised $26M and says Pat Gelsinger will join its board

Reuters Stephen Nellis

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Discussion

  • Sebastiaan Muller Sebastiaan Muller on linkedin
    So excited to share this!  Our Series A has landed and Pat Gelsinger is joining the Syenta board.  A huge thank you to the partners and organizations …
  • Pat Gelsinger Pat Gelsinger on linkedin
    Thank you Stephen Nellis and Reuters for the thoughtful coverage of Syenta.  —  Advanced packaging is becoming a critical constraint in scaling next-generation systems. …