Eliyan, which is developing chiplet interconnects to increase AI chips' performance, raised a $60M Series B co-led by Samsung Catalyst Fund and Tiger Global
Context & Ripple Effects
Eliyan’s Series B sits between its earlier $40M Series A for NuLink and a later $145M Series C tied to chiplet products and licensing. The financing arc shows sustained backing for its effort to improve data movement among chiplet components.
Samsung Catalyst Fund’s co-lead role connects the company to an investor also active in semiconductor-design tooling, including Normal Computing, reinforcing the focus on AI-chip performance constraints beyond the processor itself.
First-order effects
- Eliyan gains $60M to continue developing chiplet interconnect technology aimed at improving AI-chip performance; Samsung Catalyst Fund and Tiger Global become more directly exposed to that technical bet.
- The raise validates interconnects as a distinct target for AI-hardware investment, alongside compute and memory components.
Second-order effects
- Chip designers and chiplet suppliers face greater pressure to differentiate on how efficiently components communicate, not only on the performance of individual dies.
- Strategic investors in the semiconductor ecosystem may gain earlier visibility into Eliyan’s approach, increasing competition among alternative interconnect architectures.
Third-order effects
- If chiplet-based AI systems continue to scale, system-level data movement could become a more important source of differentiation and value capture across the AI hardware supply chain.
- The pattern points toward a more specialized AI-chip stack, where venture funding supports focused component technologies alongside investments in AI-assisted chip design.
The trend: AI infrastructure investment is broadening from flagship accelerators into the interconnect, memory, and design layers that determine system-level performance.