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2024-04-04

🧵Giant leap forward in U.S. semiconductor manufacturing: @SKhynix announces semiconductor advanced packaging investment in Purdue Research Park. Learn more about their plans: https://www.purdue.edu/... (1/4) [image]

2024-04-04 View on X

Reuters

SK Hynix plans to invest ~$3.87B in an advanced packaging plant and R&D facility in West Lafayette, Indiana, to produce high bandwidth memory chips from H2 2028

Joyce Lee / Reuters :

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